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Catalog Number:
12829
CAS Number:
18637-83-7
Diimidazolida de ácido oxálico
Purity:
≥ 98% (ensayo por titulación)
Synonym(s):
1,1'-Oxalildiimidazol
Documents
$93.14 /1G
Tamaño
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Product Information

Reactivo para la activación de ácidos carboxílicos: síntesis de ésteres, amidas, anhídridos.

Synonyms
1,1'-Oxalildiimidazol
CAS Number
18637-83-7
Purity
≥ 98% (ensayo por titulación)
Molecular Formula
C8H6N4O2
Molecular Weight
190.16
MDL Number
MFCD00043067
PubChem ID
100439
Appearance
Polvo amarillo claro
Conditions
Tienda en RT
General Information
Synonyms
1,1'-Oxalildiimidazol
CAS Number
18637-83-7
Purity
≥ 98% (ensayo por titulación)
Molecular Formula
C8H6N4O2
Molecular Weight
190.16
MDL Number
MFCD00043067
PubChem ID
100439
Appearance
Polvo amarillo claro
Conditions
Tienda en RT
Properties
Additional property information coming soon!
-
Safety and Regulations
Hazmat
No
Antibiotic
No
DEA-regulated
No
Warnings
-
Applications

Oxalic acid diimidazolide is widely utilized in research focused on

  • Peptide Synthesis: This compound serves as a coupling agent in the formation of peptide bonds, making it essential for researchers in biochemistry and pharmaceuticals who are developing new peptides and proteins.
  • Polymer Chemistry: It is used as a crosslinking agent in the production of polymers, enhancing the mechanical properties and thermal stability of materials, which is beneficial for industries like automotive and aerospace.
  • Analytical Chemistry: Oxalic acid diimidazolide is employed in various analytical methods, including chromatography, to improve the separation and detection of compounds, aiding researchers in environmental and food safety testing.
  • Drug Development: In medicinal chemistry, it plays a role in the synthesis of pharmaceutical intermediates, streamlining the development of new drugs and therapies, particularly in oncology.
  • Surface Modification: This compound is used for modifying surfaces to enhance adhesion properties in coatings and adhesives, which is crucial for manufacturers in construction and electronics.

Citas